Power Semiconductors

Power Semiconductors
  • IMI's Key Capabilities

  • Power Modules
  • Power QFN
  • Diversified Packaging - from Low to High Power and Small to Large Outline Module R and D Line
  • Low/ Medium to High Discrete Packages and Process including Au and Al Heavy Wire Bonding; Al Ribbon, Cu Clip Interconnect
  • Power Management (IC) Discrete Packaging, e.g., 3-5-7L TO-220, 3L TO-263, 3L TO-252, 3L TO251 and PowerflexTM
  • High Reliability Hermetic Packages - Metal Cans and Ceramic Packages
  • Small to Large Outline Packages
  • Full Functional/FA and Reliability Testing
  • Custom Packaging Design Services for Power/Thermal/Footprint Management
  • Product Experiences

  • Medium-High Power Packages
  • - SOT 93 3L
  • - SOT 227
  • - TO 247 3L
  • - TO 264 3/5L,
  • - Standard Package 3 (SP3)
  • - Standard Package 4 (SP4)
  • - Standard Package 6 (SP6)
  • Low-Medium Power Packages:
  • - TO 220 Fpak 3L
  • - PowerFlex 2/3/5/7L
  • - TO252 / TO251
  • - TO 263 3L
  • - 3 x 3 mm QFN
  • - 3.3 x 3.3 mm QFN
  • - 5 x 6 mm QFN
  • Small Signal Packages
  • - SOT 223 3L
  • - TO 220 2/3/5/7L

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