We are one of the few companies in the world capable of handling not only the electronics manufacturing side of the power modules but also the power semiconductor side of it. We have the capability to scale and produce within a wide breadth of module specifications.

Let us know your requirements. We may be able to fill your needs on a global scale. Contact our manufacturing solutions experts if you wish to know more about our capabilities or get a quote.


  • Design for Manufacturability
  • Materials Qualification
  • Medium to high power discrete packages and process
  • Pre-certification Testing
  • Product Miniaturization
  • Prototyping
  • RoHS Compliant Lines
  • Simultaneous Engineering
  • Test Systems Development
  • Functional/FA and Reliability Testing
  • Diversified Packaging - from Low to High Power and Small to Large Outline Module R and D Line
  • Power Management (IC) discrete packaging, , and PowerflexTM
  • Reject Profile Analysis (RPA)
  • Repair Services
  • Rigid Printed Circuit Board Assembly
  • Custom Packaging Design Services for Power/Thermal/Footprint Management
  • High Reliability Hermetic Packages - Metal Cans and Ceramic Packages
  • Small to Large Outline Packages
  • Low/ Medium to High Discrete Packages and Process including Au and Al Heavy Wire Bonding; Al Ribbon, Cu Clip Interconnect

IMI Markets Power Electronics


IMI Markets Power Electronics

  • Medium-High Power Packages
    •  SOT 93 3L
    •  SOT 227
    •  TO 247 3L
    •  TO 264 3/5L,
    •  Standard Package 3 (SP3)
    •  Standard Package 4 (SP4)
    •  Standard Package 6 (SP6)
  • Low-Medium Power Packages
    •  TO 220 Fpak 3L
    •  PowerFlex 2/3/5/7L
    •  TN234 / TN233
    •  TO 263 3L
    •  3 x 3 mm QFN
    •  3.3 x 3.3 mm QFN
    •  5 x 6 mm QFN
  • Small Signal Packages
    •  SOT 223 3L
    •  TO 220 2/3/5/7L