While thriving on speed and quality, we cut down time-to-market and maintain the highest product quality.

We offer rapid prototyping and make every effort to get it right the first time. By offering process development and tool design locally, you
save on valuable lead-time.

Our close collaboration with you from design concept to mass production, while our global outsourcing team procures from global
competitive suppliers ensure that you get the best quality at reasonable cost.

New Product Introduction

Here at IMI, NPI, or New Product Introduction, is a crucial process that involves the development and launch of a new or upgraded device that brings new products from concept to market efficiently and effectively. The process includes defining, developing, and launching a new product, with the goal of creating a functional prototype under ideal conditions. The design phase focuses on the product itself rather than the manufacturing method, and our design engineers collaborate to develop product ideas until the best solution is found.

The process we follow is structured to facilitate early involvement in design and manufacturing, enabling seamless transition from development to high-volume production. This process ensures that products meet quality standards, are manufacturable, and align with customer requirements.

Our team is open to meaningful partnerships with contract manufacturers early in any product's lifecycle to speed up the time to market and decrease redesign costs.

Prototyping and Manufacturing

  • Quick-Turn Prototyping: Lead time of 1 week for SMT and 2 weeks for backend line.
  • Standard SMT Line: Lead time of 2 weeks.
  • Standard Backend Line: Lead time of 6 weeks.

prototyping and manufacturing

Design for Manufacturability (DFM)

Design for Manufacturability (DFM)

  • Software Tools: Vayo DFM Expert, Vayo CLM, Vayo Stencil Designer, Draftsight, LibreCAD, GC-Prevue, ViewMate Pro.
  • PCB Fabrication Review: Signal layer checks, drill and route checks.
  • PCB and Mechanical Assembly Review: Component spacing, SMD land pattern checks.
  • Stencil Design: Solder paste printing, adhesive printing, BGA ball attach, etc.
  • Panel Design: Different circuit arrangements, step-and-repeat, combo panels, multi-board designs.

Tooling and Design Capabilities

  • Tooling Design Engineers: Expertise in CAD/CAM, trim, form, singulation processes, material selection, mold design, and automation design.
  • Production Jigs & Fixtures: Various holders, racks, carriers/pallets, cleaning fixtures, wire wrapping fixtures, semi-auto attachment jigs, curing jigs. soldering jigs, precision design, prototype design, sheet metal design
  • Machine Design: UV curing chambers, cleaning chambers, test fixtures.
  • Dimensional Drawing Generation: 2D and 3D file generation, Bill of Material (BOM) generation.

Tooling and Design Capabilities

Tools and Equipment

    Tools and Equipment

    • Jet Dispense: Stencil-free solder paste jet printing.
    • Solder Paste Inspection (SPI): Automated inspection of solder paste deposit.
    • Mounter: Auto Pick and Place with various capabilities.
    • Reflow Oven: Flexible thermal profile.
    • AOI (2D and 3D): Offline inspection with a 6-phase lighting system.
    • PCBA Clean: Batch-type cleaning.
    • Visual Inspection: Manual inspection with magnification.
    • X-Ray: Offline oblique inspection.
    • Flying Probe Tester: Various power supplies and testing equipment. No need for fixtures.