PSi Technologies Laguna, Inc.
North Science Avenue
Laguna Technopark
Special Export Processing Zone
Biñan 4024, Laguna
Tel: +63 2 756 6840
Markets Served
Industrial, Automotive, Computing, Communications, and Consumer
Site Capabilities
- Power Component Discrete Packaging, e.g., 2L,3L,4L TO-247, 3L TO252 , 2L,3L TO-220
- Silicon Carbide and Gallium Nitride Packaging.
- Ag Sintering Process
- Diversified Packaging - from Low to High Power and Small to Large Outline
- R&D line/ Captive Lines for Power QFN and Modules .
- Customized Power Packaging Requirements
- Low/ Med Power Discrete Packaging and Processes including Au Wire Bonding
- Al Ribbon, Cu Clip interconnect
- 3D Packaging, MCM ,High Reliability OFN Packages: 3 x 3 mm,3.3x3.3 mm, 4x5 mm, 5x6mm, 6x5mm 8x8 mm at 1 mm to 1.5 mm package height
Certifications
